P/N: Inlay9212

IC type: Various. Contact B-Id for selection and availability
Dimension: 92 x 12 mm
Core material: Polyimide / copper
Operating temperature*: -4F ~ + 185F / -20C ~ +85C
Storage temperature*: -4F ~ +248F / -20C ~ +120C (reduced data retention at higher temperature)
Form factor: Dry inlay, wet inlay, label, roll form

 

P/N: Inlay957

IC type: Various.  Contact B-Id for selection and availability
Dimension: 95 x 7 mm
Core material: Polyimide / copper
Operating temperature*: -4F ~ +185F / -20C ~ +85C
Storage temperature*: -4F ~ + 248F / -20C ~ +120C (reduced data retention at higher temperature)
Form factor: Dry inlay, wet inlay, label, roll form

 

P/N: Inlay72165

IC type: Various. Contact B-Id for selection and availability
Dimension: 72 x 16.5 mm
Core material: Polyimide / copper
Operating temperature*: -4F ~ +185F / -20C ~ +85C
Storage temperature*: -4F ~ +248F / -20C ~ +120C (reduced data retention at higher temperature)
Form factor: Dry inlay, wet inlay, label, roll form

 

P/N: Inlay5227

IC type: Various. Contact B-Id for selections and availability
Dimension: 52 x 27 mm
Core material: Polyimide / copper
Operating temperature*: -4F ~ +185F / -20C ~ +85C
Storage temperature*: -4F ~ +248F / -20C ~ +120C (reduced data retention at higher temperature)
Foam factor: Dry inlay, wet inlay, label, roll form

 

P/N: Inlay4020

IC type: Various.  Contact B-Id for selections and availability
Dimension: 40 x 20 mm
Core material: Polyimide / copper
Operating temperature*: -4F ~ +185F / -20C ~ +85C
Storage temparature*: -4F ~ +248F / -20C ~ +120C (reduced data retention at higher temperature)
Foam factor: Dry inlay, wet inlay, label, roll form

 


P/N: Inlay1810 (Near Field)

IC type: Various.  Contact B-Id for selections and availability
Dimension: 18 x 10 mm
Core material: Polyimide / copper
Operating temperature*: -4F ~ +185F / -20C ~ +85C
Storage temperature*: -4F ~ +248F / -20C ~ +120C (reduced data retention at higher temperature)
Foam factor: Dry inlay, wet inlay, label, roll form



 

P/N: Inlay1107

IC type: Various. Contact B-Id for selections and availability
Dimension: 110 x 7 mm
Core material: Polyimide / copper
Operating temperature*: -4F ~ +185F / -20C ~ +85C
Storage temperature*: -4F ~ +248F / -20C ~ +120C (reduced data retention at higher temperature)
Foam factor: Dry inlay, wet inlay, label, roll form

 

P/N: InlayOD34

IC type: Various. Contact B-Id for selections and availability
Dimension: 34mm diameter
Core material: Polyimide / copper
Operating temperature*: -4F ~ +185F / -20C ~ +85C
Storage temperature*: -4F ~ +248F / -20C ~ +120C (reduced data retention at higher temperature)
Foam factor: Dry inlay, wet inlay, label, roll form


* Please refer to specific UHF chip manufacturer's datasheet for detail chip specifications

All product specifications subject to change without notice